Keo UV 501-E-REV-A

501-E-REV-A Activator, when pre-applied to metallic, plated, ceramic, or glass substrates including printed circuit boards or PCBs, rapidly cures Multi-Cure® 600 series and 800 series structural adhesives and thermal interface materials in gaps from less than 1 mil to 20 mils.

Activator bonding increases efficiency, consistency, and reliability and provides broad tolerance of adhesive-to-activator ratios. Dymax metal bonding adhesives develop bond strengths up to 3,500 psi in 10 to 30 seconds between opaque surfaces when an adhesive activator is pre-applied to metal substrates.

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Mô tả


  • Strong structural bonds
  • Fixtures in seconds
  • No solvent flash-off time
  • No VOCs and ODCs
  • Used with Dymax 600 and 800 series structural bonding adhesives to increase bond strength
  • Cures Dymax Multi-Cure® thermally conductive adhesive in shadow areas beneath heat sinks


Property Values
Viscosity (nominal) 30-40 cP
Flash Point (Closed Cup) 245°F [118°C]
Specific Gravity 1.0
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