Keo UV 9201-W

UV Light + moisture cure 9201-W electronic encapsulant is a next-generation product formulated without materials of concern such as IBOA (isobornyl acrylate), a known skin sensitizer. This encapsulant utilizes low-sensitizing ingredients, making it optimal for assembling end-user consumer wearable devices and electronics without compromising top quality or performance.

9201-W is designed for applications such as encapsulating wire bonds, chip-on-board, or chip-on-flex circuits. This material provides electrical insulation, chemical, and environmental protection, as well as superior protection through reliability testing such as thermal shock, cycling, and vibration.

Once applied to the board, the colorless electronic encapsulant is cured with UV/Visible light within seconds and features a secondary moisture cure for shadow areas.

9201-W IBOA-free encapsulant is in full compliance with RoHS directives 2015/863/EU.

See our 2000-MW series of biocompatible IBOA- and TPO-free adhesives for medical wearables assembly.

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Mô tả


  • Free of IBOA (isobornyl acrylate), a known skin sensitizer
  • Secondary moisture cure for shadow area curing
  • Cure using UV/Visible light
  • One-part formulation – no mixing
  • No solvents added


Property Values
Viscosity (nominal) 32,000 cP
Uncured appearance Colorless
Cured elongation at break 178%
Recommended substrates polymide; PET; FR4
Cured durometer hardness D20-D40
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