Keo UV Dual-Cure 9103

Dual-Cure 9103  encapsulant is a resilient light/moisture-cure chip-encapsulating material. 9103 cures first upon exposure to UV/Visible light, then with ambient moisture over time for areas on PCBs where shadow areas are present. Bondable substrates include FR4, glass, and also Kapton®. Typical encapsulating applications include chip-on-board, flex, and glass, as well as wire bonding.

Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV/Visible light for the fastest, deepest cures.

This product is in full compliance with the RoHS2 Directives 2015/863/EU.

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Mô tả


  • Cures with UV/Visible light
  • Dual Cure – secondary moisture cure capability
  • Shadowed area performance
  • Flexible encapsulant
  • Low VOC
  • No solvents added
  • Moisture and thermal resistance
  • High CTE/low Tg for lower stress on components


Property Values
Viscosity (nominal) 25,000 cP
Cured appearance Clear
Recommended substrates FR4; Kapton; Glass
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