Keo UV Multi-Cure® 9-20801

Multi-Cure® 9-20801 cures upon exposure to UV light, heat, and/or activator. The material rapidly mounts heat-sensitive components on printed circuit boards to provide highly conductive bonds to heat-dissipation elements such as heat sinks. 9-20801 thermal interface material is a Multi-Cure® material that cures with heat or activator between opaque substrates.

The product is highly thixotropic for easy dispense and placement. Most high-speed processes require dispensing 9-20801 onto the substrate surface and also applying a thin layer of 501-E-REV-A activator to the opposite component surface.  The parts are mated and then exposed to light. This exposure cures the component edges in seconds, allowing for immediate handling and movement to the next step in the process. The material between opaque surfaces will cure over time, typically in minutes or hours. Light cure fixtures parts in place so a secondary cure can effectively cure shadow areas without interruption to process flow. Bondable substrates include PCB, FR4, silicon, ceramic, and lead frame as well as many metals.

Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. Multi-Cure® 9-20801 is in full compliance with the RoHS2 Directives 2015/863/EC.

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Mô tả

Features

  • Halogen-free
  • Highly conductive
  • Fast UV light cure for immediate fixture strength
  • Secondary activator or heat cure
  • Thixotropic for easy dispense and placement prior to cure
  • Superior adhesion to FR4 and many metals

Specifications

Property Values
Viscosity (nominal) 110,000 cP
Uncured appearance Off-white
Recommended substrates PCB; Ceramic; Lead Frame; Silicon; FR4; Metal
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