keo UV SpeedMask® 9-318-F

SpeedMask® 9-318-F cures in seconds when exposed to UV/Visible light. This removable material is designed for rapid masking of electronic components and assemblies to protect from reflow or wave soldering operations. The maskant also shields keep-out areas during conformal coating applications. The product is highly thixotropic for manual or automated dispensing on boards or components that may be difficult to mask with other methods. It has no solvents added and is silicone-free.

9-318-F also fluoresces blue for blacklight inspection. Cured masks are easily removable, eliminating the concern of ionic contamination or silicone left behind by other masking methods.

Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.

This maskant is in full compliance with the RoHS2 Directives 2015/863/EU.

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Mô tả

Features

  • Cures with UV/Visible light
  • Fluoresces blue for easy inspection
  • Highly thixotropic for manual or automated dispensing onto difficult components
  • Halogen free
  • Very low VOCs
  • Silicone free
  • Medium adhesion for peeling
  • No solvents added
  • Compliant with RoHS2 directives 2015/863/EU

Specifications

Property Values
Viscosity (nominal) 50,000 cP
Uncured appearance Translucent yellow
Recommended substrates Lead frame; Ceramic; PCB; Flex; Silicon
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